Photo of Thermal ALD

Thermal ALD


We have two thermal Picosun tools.

Typical substrate size and type

  • 50-200 mm diameter wafers or similarly thin substrates.
  • spacious chamber for 3D objects

Processing temperature

  • 50 – 450°C

Turnkey processes

  • Al2O3, TiO2, ZnO, AZO, laminate combinations
  • many other processes accessible upon request


  • Liquid, solid, gas
  • Up to 3 sources