Thermal ALD
We have two thermal Picosun tools.
Typical substrate size and type
- 50-200 mm diameter wafers or similarly thin substrates.
- spacious chamber for 3D objects
Processing temperature
- 50 – 450°C
Turnkey processes
- Al2O3, TiO2, ZnO, AZO, laminate combinations
- many other processes accessible upon request
Precursors
- Liquid, solid, gas
- Up to 3 sources