Photolithography

Lithography is carried out using a Karl-Suss MA6 mask aligner, which can accept substrates ranging from small fragments to 100 mm diameter wafers. 150 mm wafers could be accomodated by the simple addition of a larger chuck.

Using HPR504 positive resist, feature sizes as small as 0.8 µ have been printed using chrome masks. With masks produced in house at Carleton the useful minimum feature size is 2.5 µ, with 2.5 µ minimum spacing and level-to-level registration.